India launches first major semiconductor packaging facility

Indian Prime Minister Narendra Modi inaugurated the Semiconductor Assembly, Test and Packaging (ATMP) facility in Sanand city during his visit to Gujarat. It is the first major semiconductor packaging facility in India and made a significant milestone.

The facility had commenced commercial production and shipment of the first made-in-India semiconductor memory modules from the Sanand ATMP plant. The project was the first proposal approved under the India Semiconductor Mission and the groundwork for the facility was laid in September 2023.